Polishing ｜Processing Examples - Semiconductor and IC Dicing Processing, Backgrinding, etc.
Contact Us
JP EN


Polishing

  • no image

    Thin Wafer Grinding

    • Backgrinding
    • Polishing

    • Materials

      Silicon

    • Size

      t=100μm

    • Processing Delivery Time (Approximate)

      1 day

    • Processing Method

      Backgrinding, Polishing

    • Products/ Industries

      -

    • Features

      Thin Wafer Grinding



Contact

Contact Us