Orientation Flat Cutting |Processing Examples - Semiconductor and IC Dicing Processing, Backgrinding, etc.
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Orientation Flat Cutting

  • ウェハサイズダウン加工

    Wafer Size Down Processing

    • Circle Cut
    • Orientation Flat Cutting
    • Materials

      Silicon

    • Size

      6 inch → 4 inch Wafer

    • Processing Delivery Time (Approximate)

      1 day

    • Processing Method

      Circle Cut, Orientation Flat Cut

    • Products/ Industries

      Power

    • Features

      Wafer Size Down Processing



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