Orientation Flat Cutting
- All
- Backgrinding
- Circle Cut
- Dicing
- Edge Trimming
- Orientation Flat Cutting
- Polishing
- Sorting into Trays
- Visual Inspection
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Wafer Size Down Processing
- Circle Cut
- Orientation Flat Cutting
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Materials
Silicon
-
Size
6 inch → 4 inch Wafer
-
Processing Delivery Time (Approximate)
1 day
-
Processing Method
Circle Cut, Orientation Flat Cut
-
Products/ Industries
Power
-
Features
Wafer Size Down Processing