Dicing |Processing Examples - Semiconductor and IC Dicing Processing, Backgrinding, etc.
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Dicing

  • 薄ウェハの加工

    Thin Wafer Processing

    • Backgrinding
    • Dicing
    • Sorting into Trays
    • Materials

      Silicon

    • Size

      Approximately 10mm x 60mm t = 50μm

    • Processing Delivery Time (Approximate)

      2 days

    • Processing Method

      Backgrinding, Dicing and Sorting into Trays

    • Products/ Industries

      Research and Development

    • Features

      Thin Wafer Processing

  • Dicing Thick Ceramic

    • Dicing
    • Materials

      Alumina Ceramic

    • Size

      Approximately 10mm x 10mm t = 2mm

    • Processing Delivery Time (Approximate)

      3 days

    • Processing Method

      Dicing

    • Products/ Industries

      Automotive, Telecommunications

    • Features

      Dicing Thick Ceramic

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    Thick Wafer Processing

    • Dicing
    • Materials

      Nickel

    • Size

      About 3mm x 3mm t = 2mm

    • Processing Delivery Time (Approximate)

      1 day

    • Processing Method

      Dicing

    • Products/ Industries

      Optics

    • Features

      Thick Wafer Processing

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    Crystal Processing

    • Dicing
    • Sorting into Trays
    • Materials

      Crystal

    • Size

      About 6mm x 8mm t = 500μm

    • Processing Delivery Time (Approximate)

      2 days

    • Processing Method

      Dicing, Sorting into Trays

    • Products/ Industries

      -

    • Features

      Crystal Processing

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    Glass Composites Processing

    • Dicing
    • Visual Inspection
    • Materials

      Silicon + Glass Bonding

    • Size

      About 3mm x 3mm t = 1.3mm

    • Processing Delivery Time (Approximate)

      1 day

    • Processing Method

      Dicing, Visual Inspection

    • Products/ Industries

      Pressure Sensor

    • Features

      Glass Composites Processing

  • 極小チップのトレイ詰め

    Sorting Tiny Chips into Trays

    • Dicing
    • Sorting into Trays
    • Materials

      Silicon

    • Size

      About 0.5mm x 0.5mm t = 300μm

    • Processing Delivery Time (Approximate)

      2 days

    • Processing Method

      Dicing, Sorting into Trays

    • Products/ Industries

      Telecommunications

    • Features

      Sorting Tiny Chips into Trays

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    Glass Materials Processing

    • Dicing
    • Sorting into Trays
    • Visual Inspection
    • Materials

      Glasses

    • Size

      About 3mm x 5mm t = 300μm

    • Processing Delivery Time (Approximate)

      2 days

    • Processing Method

      Dicing, Sorting into Trays and Visual Inspection

    • Products/ Industries

      Optics

    • Features

      Glass Materials Processing

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    Processing glass-epoxy substrates

    • Dicing
    • Materials

      Glass Epoxy

    • Size

      4.2mm☓4.2mm t=0.5mm

    • Processing Delivery Time (Approximate)

      2 days

    • Processing Method

      Dicing

    • Products/ Industries

      Electronics

    • Features

      Processing glass-epoxy substrates

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    SiC Wafer Processing

    • Dicing
    • Sorting into Trays
    • Materials

      SiC

    • Size

      5.4mm☓5.3mm t=0.3mm

    • Processing Delivery Time (Approximate)

      4 days

    • Processing Method

      Dicing, Sorting into Trays

    • Products/ Industries

      Automotive, Telecommunications

    • Features

      SiC Wafer Processing

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    Acrylic Plate Processing

    • Dicing
    • Sorting into Trays
    • Materials

      Acrylic

    • Size

      7.5mm☓6.3mm t=1.0mm

    • Processing Delivery Time (Approximate)

      4 days

    • Processing Method

      Dicing, Sorting into Trays

    • Products/ Industries

      Electronics

    • Features

      Acrylic Plate Processing

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    Alumina Substrate Processing

    • Dicing
    • Materials

      Alumina

    • Size

      3.25mm☓18.2mm t=1.0mm

    • Processing Delivery Time (Approximate)

      2 days

    • Processing Method

      Dicing Processing

    • Products/ Industries

      Industrial Equipment

    • Features

      Alumina Substrate Processing

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    Polycarbonate Substrate Processing

    • Dicing
    • Materials

      Polycarbonate

    • Size

      13.0mm☓6.0mm t=0.5mm

    • Processing Delivery Time (Approximate)

      2 days

    • Processing Method

      Dicing

    • Products/ Industries

      Optics

    • Features

      Polycarbonate Substrate Processing

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    Gallium Oxide Processing

    • Dicing
    • Materials

      Gallium Oxide

    • Size

      2.4mm×2.4mm

    • Processing Delivery Time (Approximate)

      1 week

    • Processing Method

      Dicing

    • Products/ Industries

    • Features

      Gallium Oxide Material Dicing

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    Nickel Processing

    • Dicing
    • Materials

      Nickel

    • Size

      50mm×50mm

    • Processing Delivery Time (Approximate)

      1 week

    • Processing Method

      Dicing

    • Products/ Industries

    • Features

      Metal Material Dicing



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