Dicing
- All
- Backgrinding
- Circle Cut
- Dicing
- Edge Trimming
- Orientation Flat Cutting
- Polishing
- Sorting into Trays
- Visual Inspection
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Thin Wafer Processing
- Backgrinding
- Dicing
- Sorting into Trays
-
Materials
Silicon
-
Size
Approximately 10mm x 60mm t = 50μm
-
Processing Delivery Time (Approximate)
2 days
-
Processing Method
Backgrinding, Dicing and Sorting into Trays
-
Products/ Industries
Research and Development
-
Features
Thin Wafer Processing
-
Dicing Thick Ceramic
- Dicing
-
Materials
Alumina Ceramic
-
Size
Approximately 10mm x 10mm t = 2mm
-
Processing Delivery Time (Approximate)
3 days
-
Processing Method
Dicing
-
Products/ Industries
Automotive, Telecommunications
-
Features
Dicing Thick Ceramic
-
Thick Wafer Processing
- Dicing
-
Materials
Nickel
-
Size
About 3mm x 3mm t = 2mm
-
Processing Delivery Time (Approximate)
1 day
-
Processing Method
Dicing
-
Products/ Industries
Optics
-
Features
Thick Wafer Processing
-
Crystal Processing
- Dicing
- Sorting into Trays
-
Materials
Crystal
-
Size
About 6mm x 8mm t = 500μm
-
Processing Delivery Time (Approximate)
2 days
-
Processing Method
Dicing, Sorting into Trays
-
Products/ Industries
-
-
Features
Crystal Processing
-
Glass Composites Processing
- Dicing
- Visual Inspection
-
Materials
Silicon + Glass Bonding
-
Size
About 3mm x 3mm t = 1.3mm
-
Processing Delivery Time (Approximate)
1 day
-
Processing Method
Dicing, Visual Inspection
-
Products/ Industries
Pressure Sensor
-
Features
Glass Composites Processing
-
Sorting Tiny Chips into Trays
- Dicing
- Sorting into Trays
-
Materials
Silicon
-
Size
About 0.5mm x 0.5mm t = 300μm
-
Processing Delivery Time (Approximate)
2 days
-
Processing Method
Dicing, Sorting into Trays
-
Products/ Industries
Telecommunications
-
Features
Sorting Tiny Chips into Trays
-
Glass Materials Processing
- Dicing
- Sorting into Trays
- Visual Inspection
-
Materials
Glasses
-
Size
About 3mm x 5mm t = 300μm
-
Processing Delivery Time (Approximate)
2 days
-
Processing Method
Dicing, Sorting into Trays and Visual Inspection
-
Products/ Industries
Optics
-
Features
Glass Materials Processing
-
Processing glass-epoxy substrates
- Dicing
-
Materials
Glass Epoxy
-
Size
4.2mm☓4.2mm t=0.5mm
-
Processing Delivery Time (Approximate)
2 days
-
Processing Method
Dicing
-
Products/ Industries
Electronics
-
Features
Processing glass-epoxy substrates
-
SiC Wafer Processing
- Dicing
- Sorting into Trays
-
Materials
SiC
-
Size
5.4mm☓5.3mm t=0.3mm
-
Processing Delivery Time (Approximate)
4 days
-
Processing Method
Dicing, Sorting into Trays
-
Products/ Industries
Automotive, Telecommunications
-
Features
SiC Wafer Processing
-
Acrylic Plate Processing
- Dicing
- Sorting into Trays
-
Materials
Acrylic
-
Size
7.5mm☓6.3mm t=1.0mm
-
Processing Delivery Time (Approximate)
4 days
-
Processing Method
Dicing, Sorting into Trays
-
Products/ Industries
Electronics
-
Features
Acrylic Plate Processing
-
Alumina Substrate Processing
- Dicing
-
Materials
Alumina
-
Size
3.25mm☓18.2mm t=1.0mm
-
Processing Delivery Time (Approximate)
2 days
-
Processing Method
Dicing Processing
-
Products/ Industries
Industrial Equipment
-
Features
Alumina Substrate Processing
-
Polycarbonate Substrate Processing
- Dicing
-
Materials
Polycarbonate
-
Size
13.0mm☓6.0mm t=0.5mm
-
Processing Delivery Time (Approximate)
2 days
-
Processing Method
Dicing
-
Products/ Industries
Optics
-
Features
Polycarbonate Substrate Processing
-
Gallium Oxide Processing
- Dicing
-
Materials
Gallium Oxide
-
Size
2.4mm×2.4mm
-
Processing Delivery Time (Approximate)
1 week
-
Processing Method
Dicing
-
Products/ Industries
-
Features
Gallium Oxide Material Dicing
-
Nickel Processing
- Dicing
-
Materials
Nickel
-
Size
50mm×50mm
-
Processing Delivery Time (Approximate)
1 week
-
Processing Method
Dicing
-
Products/ Industries
-
Features
Metal Material Dicing