Backgrinding ｜Processing Examples - Semiconductor and IC Dicing Processing, Backgrinding, etc.
Contact Us
JP EN


Backgrinding

  • 薄ウェハの加工

    Thin Wafer Processing

    • Backgrinding
    • Dicing
    • Sorting into Trays

    • Materials

      Silicon

    • Size

      Approximately 10mm x 60mm t = 50μm

    • Processing Delivery Time (Approximate)

      2 days

    • Processing Method

      Backgrinding, Dicing and Sorting into Trays

    • Products/ Industries

      Research and Development

    • Features

      Thin Wafer Processing

  • no image

    Thin Wafer Grinding

    • Backgrinding
    • Polishing

    • Materials

      Silicon

    • Size

      t=100μm

    • Processing Delivery Time (Approximate)

      1 day

    • Processing Method

      Backgrinding, Polishing

    • Products/ Industries

      -

    • Features

      Thin Wafer Grinding

  • チップ状態でのバックグラインド

    Chip Grinding

    • Backgrinding

    • Materials

      Silicon

    • Size

      Approximately 10mm x 10mm t = 200μm

    • Processing Delivery Time (Approximate)

      2 days

    • Processing Method

      Backgrinding

    • Products/ Industries

      -

    • Features

      Chip Grinding



Contact

Contact Us