Service

Integrated Production System for Semiconductor Post Processing

We perform silicon wafers backgrinding, laser marking, dicing, sorting IC chips into trays and visual inspection. Supports supply of jigs such as trays and tapes. In order to respond to thinning and high strength, we have achieved a reduction in strength due to backgrinding and dicing of wafers with a thickness of 50 μm.

Semiconductor Business

So far, we have integrated backgrinding, laser marking, dicing, sorting IC chips into trays and visual inspection. From prototypes and small lots to mass production, we have established a corporate foundation that allows us to quickly respond to customer needs.