Features
We Solve Customer’s Problems
with Flexible Response.
Features
Feature 01Proposal/Solution Ability
A person in charge who is familiar with semiconductor processing technology will respond from the first contact.
We stay close to our customers’ problems and smoothly guide them to optimal solutions based on our experience and know-how.
In addition, we will be able to quickly grasp the delivery date and cost since we can talk about specifics from the initial stage.
Feature 02Integrated System for Semiconductor Back-End Processes
We perform semiconductor wafers backgrinding,
laser marking, dicing, sorting IC chips into trays and visual inspection.
It is possible to reduce the troublesome management work of the customer with one-stop support.
Feature 03Responding to Requests from Semiconductor Processing Prototypes to Mass Production
We can handle small-scale prototyping of semiconductor wafer chips and short delivery times. Please contact us for mass production as well.
We handle dicing of various materials, including ceramics, glass, glass epoxy, and special materials such as galarsenic.
In addition, we can flexibly respond to various special cut specifications such as single cut, step cut, etc. by fully automatic dicer and laser dicer.